MHz) Package (TQ = TQFP, ZP = PBGA) Full Part Numbers - MCM63P736TQ133. MCM63P736TQ100 MCM63P736TQ66 MCM63P736TQ133R MCM63P736TQ100R MCM63P736TQ66R MCM63P736ZP133 MCM63P736ZP100 MCM63P736ZP66 MCM63P736ZP133R MCM63P736ZP100R MCM63P736ZP66R MCM63P818TQ133. MCM63P818TQ100 MCM63P818TQ66 MCM63P818TQ133R MCM63P818TQ100R MCM63P818TQ66R MCM63P818ZP133 MCM63P818ZP100 MCM63P818ZP66 MCM63P818ZP133R MCM63P818ZP100R MCM63P818ZP66R MOTOROLA FAST SRAM MCM63P736eMCM63P818 194x a [eae A] a8 [ol PACKAGE DIMENSIONS TQ PACKAGE TQFP CASE 983A-01 2X 30 TIPS [a] 920 ome] RB Jo i = eI ad ~~ | le 2X 20 TIPS [ozo amma fo] A |B et ooh LIN {| 0.10 (0.004) BASE METAL IF f X=A, B, OR D VIEW Y PLATING > bt f Le c1 [| 0.13 (0.005) @|[c] A-B] D6] SECTION B-B NOTES: 1 wn DIMENSIONING AND TOLERANCING PER ANS! Y14.5M, 1982. . CONTROLLING DIMENSION: MILLIMETER. . DATUM PLANE ~H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. DATUMS -
Numbers -- MCM63P736TQ133 MCM63P736TQ133R MCM63P736ZP133 MCM63P736ZP133R MCM63P736TQ100 MCM63P736TQ100R MCM63P736ZP100 MCM63P736ZP100R MCM63P736TQ66 MCM63P736TQ66R MCM63P736ZP66 MCM63P736ZP66R MCM63P818TQ133 MCM63P818TQ133R MCM63P818ZP133 MCM63P818ZP133R MCM63P818TQ100 MCM63P818TQ100R MCM63P818ZP100 MCM63P818ZP100R MCM63P818TQ66 MCM63P818TQ66R MCM63P818ZP66 MCM63P818ZP66R MOTOROLA FAST SRAM MCM63P736*MCM63P818 19 PACKAGE DIMENSIONS TQ PACKAGE TQFP CASE 983A-01 e 4X 0.20 (0.008) H A-B D 2X 30 TIPS e/2 0.20 (0.008) C A-B D -D- 80 51 B 50 81 -A- -X- X=A, B, OR D B E/2 -B- VIEW Y E1 E BASE METAL PLATING c 31 100 1 30 D1/2 0.13 (0.005) 0.20 (0.008) C A-B D A q 2 0.10 (0.004) C -H- -C- SEATING PLANE q 3 VIEW AB S S q R2 A2 L2 L L1 VIEW AB GAGE PLANE q DIM A A1 A2 b b1 c c1 D D1 E E1 e L L1 L2 S R1 R2 q 1 2 q3 q q MCM63P736*MCM63P818 20 C A-B S D S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
Numbers -- MCM63P736TQ133 MCM63P736TQ133R MCM63P736ZP133 MCM63P736ZP133R MCM63P736TQ100 MCM63P736TQ100R MCM63P736ZP100 MCM63P736ZP100R MCM63P736TQ66 MCM63P736TQ66R MCM63P736ZP66 MCM63P736ZP66R MCM63P818TQ133 MCM63P818TQ133R MCM63P818ZP133 MCM63P818ZP133R MCM63P818TQ100 MCM63P818TQ100R MCM63P818ZP100 MCM63P818ZP100R MCM63P818TQ66 MCM63P818TQ66R MCM63P818ZP66 MCM63P818ZP66R MOTOROLA FAST SRAM MCM63P736*MCM63P818 19 PACKAGE DIMENSIONS TQ PACKAGE TQFP CASE 983A-01 e 4X 0.20 (0.008) H A-B D 2X 30 TIPS e/2 0.20 (0.008) C A-B D -D- 80 51 B 50 81 -A- -X- X=A, B, OR D B E/2 -B- VIEW Y E1 E BASE METAL PLATING c 31 100 1 30 D1/2 0.13 (0.005) 0.20 (0.008) C A-B D A 2 0.10 (0.004) C -H- -C- 3 SEATING PLANE VIEW AB S S 0.25 (0.010) R2 A2 L2 L L1 VIEW AB MCM63P736*MCM63P818 20 C A-B S D S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC
Numbers -- MCM63P736TQ133 MCM63P736TQ133R MCM63P736ZP133 MCM63P736ZP133R MCM63P736TQ100 MCM63P736TQ100R MCM63P736ZP100 MCM63P736ZP100R MCM63P736TQ66 MCM63P736TQ66R MCM63P736ZP66 MCM63P736ZP66R MCM63P818TQ133 MCM63P818TQ133R MCM63P818ZP133 MCM63P818ZP133R MCM63P818TQ100 MCM63P818TQ100R MCM63P818ZP100 MCM63P818ZP100R MCM63P818TQ66 MCM63P818TQ66R MCM63P818ZP66 MCM63P818ZP66R CH R A MOTOROLA FAST SRAM ED V I BY EE R F LE A SC S O IC EM R, O CT U ND For More Information On This Product, Go to: www.freescale.com C IN . MCM63P736*MCM63P818 19 Freescale Semiconductor, Inc. PACKAGE DIMENSIONS TQ PACKAGE TQFP CASE 983A-01 e 4X 0.20 (0.008) H A-B D 2X 30 TIPS e/2 0.20 (0.008) C A-B D -D- 80 51 B 50 81 -A- -B- Freescale Semiconductor, Inc... E1 E E1/2 31 100 1 30 D1/2 D/2 D1 D 2X 20 TIPS BY 0.20 (0.008) C A-B D A -H- -C- CH R A ED V I EE R F LE A SC 2 S O IC EM 0.10 (0.004) C S S c A1 R1 L2 L L1 M C A-B S D S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION
Numbers -- MCM63P736TQ133 MCM63P736TQ133R MCM63P736ZP133 MCM63P736ZP133R MCM63P736TQ100 MCM63P736TQ100R MCM63P736ZP100 MCM63P736ZP100R MCM63P736TQ66 MCM63P736TQ66R MCM63P736ZP66 MCM63P736ZP66R MCM63P818TQ133 MCM63P818TQ133R MCM63P818ZP133 MCM63P818ZP133R MCM63P818TQ100 MCM63P818TQ100R MCM63P818ZP100 MCM63P818ZP100R MCM63P818TQ66 MCM63P818TQ66R MCM63P818ZP66 MCM63P818ZP66R PACKAGE DIMENSIONS ZP PACKAGE 7 x 17 BUMP PBGA CASE 999-01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 0.20 (0.008) 4X A -W- PIN 1A IDENTIFIER 7 6 5 4 3 2 1 B -L- P S 16X N A B C D E F G H J K L M N P R T U G 6X DIM A B C D E F G K N P R S 119X G INCHES MIN MAX 0.551 BSC 0.866 BSC --- 0.094 0.024 0.035 0.020 0.028 0.051 0.067 0.050 BSC 0.031 0.039 0.469 0.476 0.764 0.772 0.300 BSC 0.800 BSC D R 0.30 (0.012) S T W BOTTOM VIEW 0.10 (0.004) S T TOP VIEW MILLIMETERS MIN MAX 14.00 BSC 22.00 BSC --- 2.40 0.60 0.90 0.50 0.70 1.30 1.70 1.27 BSC 0.80 1.00 11.90 12.10 1
66 MHz) Package (TQ = TQFP, ZP = PBGA) Full Part Numbers MCM63P736TQ133 MCM63P736TQ100 MCM63P736TQ66 MCM63P736TQ133R MCM63P736TQ100R MCM63P736TQ66R MCM63P736ZP 133 MCM63P736ZP 100 MCM63P736ZP66 MCM63P736ZP133R MCM63P736ZP100R MCM63P736ZP66R MCM63P818TQ133 MCM63P818TQ100 MCM63P818TQ66 MCM63P818TQ133R MCM63P818TQ100R MCM63P818TQ66R MCM63P818ZP133 MCM63P818ZP100 MCM63P818ZP66 MCM63P818ZP133R MCM63P818ZP100R MCM63P818ZP66R MOTOROLA FAST SRAM MCM63P736eMCM63P818 19PACKAGE DIMENSIONS TQ PACKAGE TQFP CASE 983A-01 4X O]oan(aoon HL Ae [O 2X 30 TIPS 0.20 (0.008)|c] A-B [D | 020 ome [S] AB) 80 SUN 51 TM TT ik k f ns XL 5 | = [E/2] X=A, B, ORD rN 7 \ VIEW Y ro} ] a= ; (Et) BASE PLATING LS \ Ev = bt = E1/2 | = 1 = {O ' 131 v c c1 IUVUVUTEAUAUANOTOEEAAAAOTOOUA * f Lol _{ D1/2 } 1_[D/2 > < [Di] > [| 0.13 (0.005)@]c] A-B] DO] - by > SECTION B-B NOTES: 2X 20 TIPS | 020 aoe a8 [ol 1. 2. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF 0.05 (0.002) ) VIEW AB a @ VIEW AB ~ 0.25 (0.010) GAGE PLANE rN, {| 0.10